Medicept Bond Plus Se (Self Etch Bonding Adhesive)

Simplified ultra-efficient bonding system based on proven ethanol/water solvent technology

Bond Plus SE

• Total etch, less technique sensitive

• Ideal for wet or dry bonding • Reduced post-operative sensitivity

Filler Loaded

• Reduced micro-leakage

• Reduced film thickness

• Increased bond strength

One bottle for ultimate simplicity of use

• Time saving • For direct & indirect applications

• Reliable: clinically proven A GREAT ALL-ROUNDER + ADDED SPEED & SIMPLICITY 7th GENERATION BONDING ADHESIVE

Core-Technologies

• Optimal filler load (15%)

• Total-Etch • Ethanol/water solvent system

 Available-in 5ml Bottle (7th Generation)