Tokuyama Ee-Bond - Intro Kit

Out of stock
SKU
Tokuyama1180
₹6,500.00
Bonding Agent
TOKUYAMA® EE-BOND is a dental adhesive system formulated for the enamel-etching technique. Utilizing Tokuyama's 3D self-reinforcing (SR) monomer, TOKUYAMA® EE-BOND chemically bonds to both enamel and dentin forming a durable 3D matrix bonding layer. This thin but durable bonding layer offers long-term marginal integrity of the esthetic restoration as well as exceptional dentinal sealing.

 

Indications

Bonding of light- or dual-cured composite to:
1. cut/uncut enamel
2. cut/uncut dentin
3. fractured porcelain/composite repair

More Information
Dispatch Date Next Day
COD Yes
Reward Points Earned 130
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